Sn-Cu Alloy Electrodeposition for Lead-Free Solder.
نویسندگان
چکیده
منابع مشابه
Mechanical Properties and Solder Joint Reliability of Low-Melting Sn-Bi-Cu Lead Free Solder Alloy
The influence of alloy composition of lowmelting Sn-Bi-Cu lead-free solder alloys on mechanical properties and solder joint reliabilities were investigated. The mechanically optimum alloy composition is Sn-40Bi-0.1Cu (mass%). The addition of 40mass%Bi improves the ductility and restrains the fillet-lifting, which are problems of lead-free solders with Bi. The addition of copper improves both th...
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ژورنال
عنوان ژورنال: Journal of the Surface Finishing Society of Japan
سال: 1999
ISSN: 0915-1869,1884-3409
DOI: 10.4139/sfj.50.1125